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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Octal 3-State Noninverting Transparent Latch with LSTTL-Compatible Inputs High-Performance Silicon-Gate CMOS The MC54/74HCT373A may be used as a level converter for interfacing TTL or NMOS outputs to High-Speed CMOS inputs. The HCT373A is identical in pinout to the LS373. The eight latches of the HCT373A are transparent D-type latches. While the Latch Enable is high the Q outputs follow the Data Inputs. When Latch Enable is taken low, data meeting the setup and hold times becomes latched. The Output Enable does not affect the state of the latch, but when Output Enable is high, all outputs are forced to the high-impedance state. Thus, data may be latched even when the outputs are not enabled. The HCT373A is identical in function to the HCT573A, which has the input pins on the opposite side of the package from the output pins. This device is similar in function to the HCT533A, which has inverting outputs. * * * * * * Output Drive Capability: 15 LSTTL Loads TTL/NMOS-Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 196 FETs or 49 Equivalent Gates LOGIC DIAGRAM 2 5 6 9 12 15 16 19 MC54/74HCT373A J SUFFIX CERAMIC PACKAGE CASE 732-03 1 20 20 1 20 1 N SUFFIX PLASTIC PACKAGE CASE 738-03 DW SUFFIX SOIC PACKAGE CASE 751D-04 SD SUFFIX SSOP PACKAGE CASE 940C-03 DT SUFFIX TSSOP PACKAGE CASE 948E-02 20 1 20 1 ORDERING INFORMATION MC54HCTXXXAJ Ceramic MC74HCTXXXAN Plastic MC74HCTXXXADW SOIC MC74HCTXXXASD SSOP MC74HCTXXXADT TSSOP PIN ASSIGNMENT OUTPUT ENABLE Q0 D0 D1 NONINVERTING OUTPUTS Q1 Q2 D2 Q5 D3 Q6 Q7 PIN 20 = VCC PIN 10 = GND Q3 GND 8 9 10 13 12 11 D4 Q4 LATCH ENABLE 1 2 3 4 5 6 7 20 19 18 17 16 15 14 VCC Q7 D7 D6 Q6 Q5 D5 D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 3 4 7 8 13 14 17 18 Q0 Q1 Q2 Q3 Q4 OUTPUT ENABLE 10/95 (c) Motorola, Inc. 1995 IIIIIIIIIIIIIII II III I I IIIIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II III I II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II 1 Design Criteria Value 49 Units ea. ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product 1.5 5.0 W pJ .0075 * Equivalent to a two-input NAND gate. 1 LATCH ENABLE 11 FUNCTION TABLE Inputs Output Enable L L L H Latch Enable H H L X D H L X X Output Q H L No Change Z X = don't care Z = high impedance REV 6 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I IIIIIIIIIIIIIIIIIIIIIII I III I I I I IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III I III I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C SSOP or TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII MAXIMUM RATINGS* MOTOROLA DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) RECOMMENDED OPERATING CONDITIONS MC54/74HCT373A Symbol Vin, Vout Symbol Symbol VCC Vout Tstg ICC Iout VCC Vin PD TL VOH tr, tf Iin VOL TA VIH VIL Iin Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC, SSOP or TSSOP Package) (Ceramic DIP) Storage Temperature Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package SSOP or TSSOP Package DC Supply Current, VCC and GND Pins DC Output Current, per Pin DC Input Current, per Pin DC Output Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Supply Voltage (Referenced to GND) Input Rise and Fall Time (Figure 1) Operating Temperature, All Package Types DC Input Voltage, Output Voltage (Referenced to GND) DC Supply Voltage (Referenced to GND) Maximum Input Leakage Current Maximum Low-Level Output Voltage Minimum High-Level Output Voltage Maximum Low-Level Input Voltage Minimum High-Level Input Voltage Parameter Parameter Parameter Vin = VIH or VIL |Iout| 6.0 mA Vin = VIH or VIL |Iout| 20 A Vin = VIH or VIL |Iout| 6.0 mA Vin = VIH or VIL |Iout| 20 A Vin = VCC or GND Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A v v v v v v Test Conditions - 0.5 to VCC + 0.5 - 1.5 to VCC + 1.5 - 65 to + 150 - 0.5 to + 7.0 2 - 55 Min 4.5 Value 0 0 75 35 20 260 300 750 500 450 + 125 VCC Max 500 5.5 VCC V 5.5 4.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 4.5 5.5 Unit Unit mW mA mA mA _C _C _C ns V V V V V - 55 to 25_C 0.1 0.26 3.98 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Guaranteed Limit v 85_C v 125_C High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 0.33 3.84 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 v 1.0 0.4 0.1 0.1 3.7 4.4 5.4 0.8 0.8 2.0 2.0 v Unit A V V V V IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I NOTE: 1. Total Supply Current = ICC + ICC. NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol Symbol Symbol ICC ICC IOZ tPLH, tPHL tPLH, tPHL tTLH, tTHL tPZL, tPZH tPLZ, tPHZ CPD Cout tr, tf Cin tsu tw th TIMING REQUIREMENTS (VCC = 5.0 V 10%, Input tr = tf = 6.0 ns) AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns) DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Additional Quiescent Supply Current Maximum Quiescent Supply Current (per Package) Maximum Three-State Leakage Current Power Dissipation Capacitance (Per Latch)* Maximum Input Rise and Fall Times (Figure 1) Minimum Pulse Width, Latch Enable (Figure 2) Minimum Hold Time, Latch Enable to Input D (Figure 4) Minimum Setup Time, Input D to Latch Enable (Figure 4) Maximum Three-State Output Capacitance (Output in High-Impedance State) Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 5) Maximum Propagation Delay, Output Enable to Q (Figures 3 and 6) Maximum Propagation Delay, Output Enable to Q (Figures 3 and 6) Maximum Propagation Delay, Latch Enable to Q (Figures 2 and 5) Maximum Propagation Delay, Input D to Q (Figures 1 and 5) Parameter Parameter Parameter Vin = 2.4 V, Any One Input Vin = VCC or GND, Other Inputs lout = 0 A Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0 A Test Conditions 3 VCC V 5.5 5.5 5.5 - 55 to 25_C - 55 to 25_C 500 Typical @ 25C, VCC = 5.0 V 12 10 10 15 10 12 35 30 32 28 - 55 to 25_C 0.5 4.0 -55_C Guaranteed Limit Guaranteed Limit 2.9 Guaranteed Limit v 85_C v 85_C v 85_C v 125_C 500 15 13 13 15 10 15 44 38 40 35 65 5.0 40 25_C to 125_C MC54/74HCT373A v 125_C v 125_C 2.4 500 10 18 15 15 15 10 18 53 45 48 42 160 MOTOROLA Unit Unit Unit mA A A pF pF pF ns ns ns ns ns ns ns ns ns MC54/74HCT373A EXPANDED LOGIC DIAGRAM D0 3 D Q D1 4 D Q D2 7 D Q D3 8 D Q D4 13 D Q D5 14 D Q D6 17 D Q D7 18 D Q LE LATCH 11 ENABLE OUTPUT 1 ENABLE LE LE LE LE LE LE LE 2 Q0 5 Q1 6 Q2 9 Q3 12 Q4 15 Q5 16 Q6 19 Q7 SWITCHING WAVEFORMS tr INPUT D tPLH Q tTLH 90% 1.3 V 10% tTHL 2.7 V 1.3 V 0.3 V tPHL tf 3V LATCH ENABLE GND tPLH Q 1.3 V tPHL 1.3 V tw 1.3 V GND 3V Figure 1. Figure 2. OUTPUT ENABLE 3V 1.3 V GND tPZL tPLZ HIGH IMPEDANCE 10% tPZH tPHZ 90% VOH HIGH IMPEDANCE VOL LATCH ENABLE INPUT D 1.3 V tsu GND th 3V 1.3 V GND VALID 3V Q 1.3 V Q 1.3 V Figure 3. Figure 4. MOTOROLA 4 High-Speed CMOS Logic Data DL129 -- Rev 6 MC54/74HCT373A TEST CIRCUITS TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST TEST POINT OUTPUT 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. CL* CL* * Includes all probe and jig capacitance * Includes all probe and jig capacitance Figure 5. Figure 6. High-Speed CMOS Logic Data DL129 -- Rev 6 5 MOTOROLA MC54/74HCT373A OUTLINE DIMENSIONS J SUFFIX CERAMIC PACKAGE CASE 732-03 ISSUE E B A F C L DIM A B C D F G H J K L M N NOTES: 1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. MILLIMETERS MIN MAX 23.88 25.15 6.60 7.49 3.81 5.08 0.38 0.56 1.40 1.65 2.54 BSC 0.51 1.27 0.20 0.30 3.18 4.06 7.62 BSC 0_ 15 _ 0.25 1.02 INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040 20 1 11 10 N H D SEATING PLANE G K J M -A- 20 11 N SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE E B 1 10 C L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 -T- SEATING PLANE K M E G F D 20 PL N J 0.25 (0.010) M 20 PL 0.25 (0.010) TA M M TB M DIM A B C D E F G J K L M N -A- 20 11 DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D-04 ISSUE E 10X -B- 1 10 P 0.010 (0.25) M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 20X D M 0.010 (0.25) TA S B J S F R X 45 _ C -T- 18X SEATING PLANE G K M MOTOROLA 6 High-Speed CMOS Logic Data DL129 -- Rev 6 MC54/74HCT373A OUTLINE DIMENSIONS SD SUFFIX PLASTIC SSOP PACKAGE CASE 940C-03 ISSUE B 20X K REF 0.12 (0.005) M TU S V 0.25 (0.010) S N M N L/2 L PIN 1 IDENT 20 11 B 1 10 F DETAIL E K A -V- 0.20 (0.008) M -U- J S J1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 7.07 7.33 5.20 5.38 1.73 1.99 0.05 0.21 0.63 0.95 0.65 BSC 0.59 0.75 0.09 0.20 0.09 0.16 0.25 0.38 0.25 0.33 7.65 7.90 0_ 8_ INCHES MIN MAX 0.278 0.288 0.205 0.212 0.068 0.078 0.002 0.008 0.024 0.037 0.026 BSC 0.023 0.030 0.003 0.008 0.003 0.006 0.010 0.015 0.010 0.013 0.301 0.311 0_ 8_ TU SECTION N-N -W- 0.076 (0.003) -T- SEATING PLANE C D G H DETAIL E 20X K REF DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948E-02 ISSUE A M 2X L/2 20 11 L PIN 1 IDENT 1 10 B -U- J J1 N 0.15 (0.006) T U S A -V- N F C D 0.100 (0.004) -T- SEATING PLANE G H DETAIL E High-Speed CMOS Logic Data DL129 -- Rev 6 7 IIII IIII IIII IIII 0.15 (0.006) T U S 0.10 (0.004) TU S V S EEE CCC EEE CCC EEE CCC EEE CCC K1 K K1 DETAIL E SECTION N-N 0.25 (0.010) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ M DIM A B C D F G H J J1 K K1 L M -W- MOTOROLA MC54/74HCT373A Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 MOTOROLA CODELINE *MC54/74HCT373A/D* 8 MC54/74HCT373A/D High-Speed CMOS Logic Data DL129 -- Rev 6 |
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